BGA手动空隙测量：画气泡圆+焊球圆交互、拖拽调整、空隙率计算、VoidLimit编辑、右键删除

2026-04-27 10:38:56 +08:00
parent e2f1b13e0e
commit e7ae7085df
6 changed files with 350 additions and 6 deletions
@@ -443,7 +443,7 @@
                            Text="通孔填锡率" />
                    </StackPanel>

-                    <!--  第三列: BGA空隙测量  -->
+                    <!--  第三列: BGA空隙测量 + 气泡测量  -->
                    <StackPanel>
                        <telerik:RadRibbonButton
                            telerik:ScreenTip.Description="BGA焊球空隙率检测"
@@ -452,6 +452,13 @@
                            Size="Medium"
                            SmallImage="/Assets/Icons/bga.png"
                            Text="BGA空隙" />
+                        <telerik:RadRibbonButton
+                            telerik:ScreenTip.Description="手动气泡测量（魔棒+画笔）"
+                            telerik:ScreenTip.Title="气泡测量"
+                            Command="{Binding BubbleMeasureCommand}"
+                            Size="Medium"
+                            SmallImage="/Assets/Icons/pores.png"
+                            Text="气泡测量" />
                    </StackPanel>
                </telerik:RadRibbonGroup>
                <!--